DISCO CORPORATION
DISCO Technical Review 與Kiru（切）・Kezuru（削）・Migaku（磨）技術相關的見解‧論文之頁面。
KABRA｜DISCO CORPORATION
This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the …
DISCO cautions you that a number of important factors could cause actual results to differ materially from those discussed in the forward-looking statements, and you should not make …
株式会社ディスコ - DISCO
DISCO Technical Review Kiru（切る）・Kezuru（削る）・Migaku（磨く）技術に関する技術見解・ 論文のページです。
DISCO CORPORATION
Introduction to DISCO solutions that help customers tackle issues concerning Kiru・Kezuru・Migaku processes, including technical know-how, test cuts, and processing services.
Human Capital Strategy | Human Capital | SDGs / ESG / CSR
DISCO Group adopts ordinary profit margin as an important index within our business strategy. By linking the consolidated ordinary profit margin ratio not only to bonuses for executives but also …
In this review, we discuss this topic in detail and present DISCO’s SD engines. DISCO is the official alliance partner of Hamamatsu Photonics, and we have been given a comprehensive …
In this paper, with a focus on the silicon thinning process, the processing quality of DISCO’s grinder polisher (DGP8762), which is widely adopted for the silicon thinning process, was …
Edge trimming has gradually been adopted in FEOL processes. We will further evaluate and develop this technology to satisfy the requirement in the advanced device process. Fig. 9 …
As it is expected that the demand for DISCO’s precision processing tools, which are used in the manufacturing of semiconductors and electronic components, will also continue to increase, …