Samtec’s Si-Fly low-profile cable assemblies provide several mounting options in data center, HPC, and AI applications.

Vishay’s VO1401AEFTR and VOR1003M4T SSRs with high current capability and high isolation voltage can operate in harsh ...

Omnivision’s OX01N1B low-power 1.5-MP global shutter sensor enables compact camera modules in driver monitoring systems.

At OFC 2025, imec unveiled a proof of concept for a photonics-based CDM FMCW 144-GHz distributed radar system, which could ...

Hybrid circuit protection devices, using a combination of technologies, provide better protection for industrial Ethernet ...

Vishay’s ISOA200 thick-film power resistors with optional NTC thermistor and phase-change thermal interface material saves ...

Littelfuse’s IXD2012NTR high-side and low-side gate driver drives two N-channel MOSFETs or IGBTs in a half-bridge ...

Molex’s new report finds that advanced connector design is needed for constant connectivity in military, avionics, and ...

At Auto Shanghai, Intel unveils its next-gen AI-enhanced SDV SoC, claiming the automotive industry’s first multi-node chiplet ...

Renesas Electronics introduces the RA0E2 MCUs with ultra-low power consumption and an extended temperature range.

L-com expands its connector portfolio with rugged Bulgin circular connectors and other interconnects for harsh environments.

JEDEC announced the publication of the HBM4 DRAM standard, delivering higher bandwidth, efficiency, and capacity for AI and ...