The point that Europe has no appetite for manufacturing chips is underlined decisively by the sales of semiconductor manufacturing equipment in 2024, as compiled by the industry body SEMI. European ...

A project in the UK and the Netherlands is using Large Language Models (LLMs) to create hardware designs with a technique it calls Conversational Prototyping. While LLMs are widely used for developing ...

Flow Computing in Finland has started alpha testing of a RISC-V compiler for its Parallel Processing Unit (PPU) AI block. The PPU is capable of increasing any CPU architecture by up to 100X by using ...

Neo said it has developed both one transistor, one capacitor (1T1C) and three transistor, zero capacitor (3T0C) X-DRAM cells that are stackable. The company said that TCAD simulation has predicted the ...

In a major move for the automotive industry, Harman is to make its full connected services platform open source for scalable software defined vehicle (SDV) designs. The open source services are ...

KDDI Corporation, headquartered in Tokyo, has formed a strategic partnership with DriveNets Ltd., based in Israel, which focuses on promoting open network architecture. The open network architecture ...

Filtronic in the UK has signed a deal to develop and supply filter and diplexer assemblies to the next generation of OneWeb satellites. The satellites will be built by Airbus Defence and Space in ...

Infineon Technologies has signed a deal with US tier one supplier Visteon to develop next generation power conversion systems for electric vehicles. The deal will see Visteon use both silicon carbide ...

Omron Electronic Components Europe has developed a compact DC power relay for inrush protection in battery-charging systems up to 800V. The G9EJH-1-E has SPST (single-pole single-throw) normally open ...

Specialty foundry Tower Semiconductor Ltd. (Migdal Haemek, Israel) withdrew from a plan to build a wafer fab in India “five or six months ago” according to CEO Russell Ellwanger. Speaking during an ...

Space Forge in Wales has raised £22.6m ($30m) for its second generation materials factory ahead of the launch of its first. The Series A round is the largest in UK space tech history and was led by ...

Researchers in China have developed a groundbreaking method to build high-aspect-ratio 3D microstructures with sub-10 micron resolution for RF sensors. The technique achieves deep trenches with a 1:4 ...