According to HCL Group Chairperson Roshni Nadar Malhotra, the project will combine “HCL’s engineering DNA” with “Foxconn’s ...

In 2023, the Fan-out Wafer Level Packaging (FOWLP) segment led the Interposer and Fan-out Wafer Level Packaging Market, representing around 67% of total revenue. Its popularity stems from superior ...

For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP). In addition to wafer solutions ...