Freudenberg’s innovative fine denier spunbond materials rely on flexible manufacturing capabilities, which enable a high ...

At India’s largest global flexible packaging solution company Uflex Limited ... the engineers at Uflex designed the EL-1300 Extrusion Lamination Machine that seamlessly carries out the process of ...

Freudenberg’s innovative fine denier spunbond materials rely on flexible manufacturing capabilities ... Efficient converting and high durability for packaging and coating The fully synthetic PET/PE ...

Intel asserts it is the industry leader in packaging technologies for semiconductors, which today have expanded capabilities ...

At SPC Impact, industry professionals from Kraft Heinz and Emerald Technology Ventures discuss how key partnerships are ...

YORK, Pa., April 17, 2025 (GLOBE NEWSWIRE) -- C-P Flexible Packaging (C-P), a leading manufacturer of flexible packaging, announces that Dave Klopp has joined the company as Vice President of Sales.

Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel ...