Chiba University has found a way to cut blocks of diamond into thin wafers along a difficult but desirable crystal ... but diamond wants to crack along its 111 plane, so any crack-based separation ...

MILPITAS, Calif., April 29, 2025 /PRNewswire/ -- Worldwide silicon wafer shipments increased 2.2% year-on-year (YoY) to 2,896 million square inches (MSI) from the 2,834 MSI recorded during the same ...

The monocrystalline growth furnaces included in the shipment employ the Czochralski (CZ) crystal growth method, a well-established technique in the photovoltaic industry. The furnaces are equipped ...