As industrial and power electronics operate in increasingly harsh environments, manufacturers face growing challenges related ...
In recent years, electronics engineers have been trying to identify semiconducting materials that could substitute for silicon and enable the further advancement of electronic devices. Two-dimensional ...
NEW TAIPEI, TAIWAN, CHINA, January 21, 2026 /EINPresswire.com/ -- Fong Yong Chemical Co., Ltd. has emerged as a leading ...
Interesting Engineering on MSN
Breakthrough semiconductor manufacturing method could reshape 2D perovskite device design
Moving beyond the limits of conventional chip fabrication, a joint China–US research team has ...
CES 2026 showcases the latest AI-powered devices and systems, from vision chips for automotive to sensing solutions for AI ...
A new technical paper titled “Scaling of Two-Dimensional Semiconductor Nanoribbons for High-Performance Electronics” was published by researchers at Purdue University, National University of Singapore ...
GAOXIN DISTRICT, BAOJI CITY, SHAANXI PROVINCE, CHINA, January 19, 2026 /EINPresswire.com/ -- Molybdenum plays a vital ...
Tech Xplore on MSN
New smart chip reduces consumption and computing time, advancing high-performance computing
A new chip aims to dramatically reduce energy consumption while accelerating the processing of large amounts of data.
ZAGG®, a global leader in accessories and technologies that empower mobile lifestyles, today announced it has been named a ...
UCLA researchers identify a metal with ~3× the heat conduction of copper, offering a potential leap in cooling for chips, AI accelerators, and next-gen electronic systems.
Explore how repairable electronics, modular tech, and growing right to repair laws are reshaping consumer devices, reducing e ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results