In January 2026, Cadence unveiled its new Chiplet Spec-to-Packaged Parts ecosystem, aimed at simplifying engineering and speeding time to market for chiplets used in physical AI, data center and ...
What Hi-Fi? on MSN
After nearly two years, this CD transport is finally ready for release
Was Mission's 778CDT worth the wait?
Anthropic’s Cowork brings Claude Code–style AI agents to the desktop, letting Claude access and manage local files and browse ...
Hardware Root of Trust in the Quantum Computing Era: How PUF-PQC Solves PPA Challenges for SoCs ...
CEO Chen is betting on Edge AI - which can run AI algorithms locally rather than in the cloud - to boost the adoption of RISC ...
VANCOUVER, British Columbia and AUSTIN, Texas, Jan. 16, 2026 (GLOBE NEWSWIRE) -- Inspire Semiconductor Holdings Inc. (“InspireSemi” or the ...
In most software interviews a decade ago, success hinged on how quickly a candidate could write code on a whiteboard. Today, ...
In response, Interview Kickstart has expanded its Full-Stack Engineering Interview Prep Masterclass, a comprehensive interview-preparation program designed to help experienced engineers strengthen ...
At the classroom level, AI-informed networks enable a range of new and emerging learning technologies. For example, Aldine ...
Goldman Sachs & Co. LLC serves as financial advisor and Erdinast Ben Nathan Toledano and Davis Polk and Wardwell LLP serve as Israeli and US legal counsel to Mobileye, respectively. Shibolet & Co. and ...
Chipset architecture used to be split into two main chips: the Northbridge for fast stuff like the CPU and RAM, and the ...
AI has been embraced across the architecture industry. Experts and firm leaders explain how AI will change architecture in ...
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