However, silicon and glass have very low coefficient of thermal expansion (CTE), 3-8 ppm/°C, compared with organic printed wiring board (PWB), which has a CTE of 12-18 ppm/°C. The large CTE mismatch ...

Specifically regarding the limited engagement offered by the Board and the Company's insistence on all discussions being routed through the CEO and Chairman, Glass Lewis states: "We are thus ...