Dave Murrin is an accomplished sales professional with 40 years of sales experience in the electronics industry. Dave’s approach is solutions-oriented, which has benefited customers in high-tech, ...

Master Bond’s Supreme 10HTLV is a one-part, heat-cured epoxy. The non-frozen system features a moderately high viscosity with good flow characteristics and does not thicken over time. Supreme 10HTLV ...

ST. PETERSBURG, FL – Jabil has raised its full-year fiscal 2026 outlook, citing stronger-than-expected demand across key end markets, particularly data center infrastructure tied to artificial ...

Altus Group, a leading distributor of electronics manufacturing equipment in the UK and Ireland, has expanded its Aftersales operation to its largest size to date with the appointment of new engineer, ...

Critical Manufacturing, the Manufacturing Operations Platform company making Industry 4.0 a reality, today announced a new partnership with Canonical that combines Critical Manufacturing’s advanced ...

Incap Estonia has strengthened the quality of its production with the addition of a new high-precision flying probe system. The investment enhances the factory’s ability to meet the diverse needs of ...

Minneapolis, MN – The SMTA is excited to announce the technical program for the 2026 Wafer-Level Packaging Symposium. The symposium will be held February 17-19, 2026 at The Hyatt Regency San Francisco ...

Sascha’s appointment marks another milestone as Neways expands its role within the European defense ecosystem. With demand rising and new business accelerating, Neways is investing in a more ...

Hirose's 1.0mm coaxial connector designed for high-frequency applications up to 110GHz. The connector complies with IEEE Std 287 and is engineered to support advanced RF and microwave designs.

Mirtec TAL 3D Scan inspection module attaches to MV-6 Omni 3-D AOI, performing pre-inspection while main 3-D AOI operates. From a system-wide perspective, this is equivalent to inspecting two PCBs ...

Testing transfer efficiency and repeatability for microminiature devices down to 01005 discretes and 0.4mm BGAs. High-reliability PCB assemblers face multiple challenges from the mainstream industry’s ...

Indium Corp. SiPaste C312HF halogen-free, cleanable solder paste is for fine-feature printing. Designed with Type 7 powder for aperture sizes down to 60μm, it enables fine-feature printing in advanced ...