Chiplets have emerged as a critical implementation paradigm for semiconductor products, primarily because they can deliver cost benefits relative to a non-chiplet-based approach. The first, most ...

By embedding digital logic directly into the GaN chiplet, Intel collapses what is typically a small system into a single unit ...

Experts At The Table: Demand for chiplets is growing, but debate continues about whether standards and general-purpose chiplets will kick-start the commercialization boom, or whether success will come ...

Intel has unveiled a Gallium Nitride (GaN) chiplet measuring a mere 19 micrometers in thickness. First showcased at the IEEE International Electron Devices Meeting in December last year, this ...

Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the ...

Intel is showing off a wafer-thin trick that could shake up power-hungry kit. The chipmaker’s foundry boffins have built what they claim is the world’s thinnest GaN chiplet at just 19 micrometres.

Sarcina launches UCIe-A/S Packaging IP, enabling high-performance, scalable chiplet interconnects with reduced ...

Intel Foundry has created the world's thinnest gallium nitride (GaN) chiplet — its base silicon measuring just 19 micrometers (μm) thick — harvested from a 300 millimeter (mm) GaN-on-silicon wafer.¹ ...

AMD is preparing to revolutionize the gaming GPU market with its new UDNA architecture, which will feature a “multi-chiplet” design. The “multi-chiplet” design is a technology that, according to new ...