The importance of traditionally acceptable sources of variation has started to become more critical as semiconductor technologies continue to push into smaller technology nodes. New metrology ...
Imec and EVG have demonstrated 1.8µm pitch overlay accuracy for wafer-to-wafer bonding. Wafer-to-wafer bonding is a promising technique for enabling high-density integration of future ICs through 3D ...
Synopsys, Inc. (NASDAQ: SNPS) today announced a pre-wafer simulation solution to help semiconductor manufacturers reduce process node development time. The new solution provides a comprehensive ...
The testing of the semiconductor dies produced by a wafer fabrication plant involves a long series of operations requiring meticulous care. The time spent performing these tests markedly affects both ...
Overlay metrology tools improve accuracy while delivering acceptable throughput, addressing competing requirements in increasingly complex devices. In a race that never ends, on-product overlay ...
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