Layer transfer is a key technology for assembling disaggregated chiplet systems and leading edge chip making proceses. This previously required glass carriers to hold the die and making packages ...

Intel is joining hands with European miniaturization expert CEA-Leti to develop layer transfer technology for two-dimensional transition-metal dichalcogenides (2D TMDs) on 300-mm wafers in a quest to ...

DATA on momentum transfer from velocity measurements are usually applied to mass transfer processes using the accepted analogies between heat, mass and momentum transfer 1. Doubts about these ...

Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...