Researchers at the Jülich Research Center and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a material that has never existed before: a stable alloy of carbon, silicon, ...

Control of recombination features in the layers of the semiconductor element is considered to be one of the most effective methods of increasing performance and many other characteristics of power ...

(Nanowerk News) Postdoctoral fellow Keiki Fukumoto, together with researcher Ken Onda and Professor Shinya Koshihara, all of the Graduate School of Science and Engineering at the Tokyo Institute of ...

Element Solutions has acquired Kuprion, Inc., a developer of next-generation nano-copper technology to the semiconductor, circuit board and electronics assembly markets. The company’s ActiveCopper™ ...

BY THE PRESIDENT OF THE UNITED STATES OF AMERICA A PROCLAMATION 1. On December 22, 2025, the Secretary of Commerce (Secretary) transmitted to me a ...

The sensors that allow satellites to take measurements are happiest when cold. Mechanical pumps onboard keep sensors' semiconductor elements at temperatures hundreds of degrees below zero. But these ...

Power management is generally accomplished by a combination of small signal transistors acting as the brain, power transistors acting as solid state switches that control the power flow from the ...

Mathematics of Computation, Vol. 59, No. 200 (Oct., 1992), pp. 383-401 (19 pages) In this paper a new explicit finite element method for numerically solving the drift-diffusion semiconductor device ...

OTTAWA, Nov. 24, 2020 (GLOBE NEWSWIRE) -- Precedence Research, Recently Published Report on “Compound Semiconductor Market (By Deposition Technology: Molecular Beam Epitaxy, CVD, Ammonothermal, ...

Thomas Vandervelde receives funding from the Air Force Office of Scientific Research, National Science Foundation, Office of Naval Research, NASA, the Intelligence Community, and Tufts University. Our ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...