The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

With Samsung Electro-Mechanics effectively having sold out next year's production volume of flip-chip ball grid array (FC-BGA), it is said to plan to ramp up the utilization rate of its Vietnam ...

TOPPAN aims to launch mass production on the new FC-BGA manufacturing line by the end of fiscal 2025. With the Singapore Plant currently under construction and due to launch operations in late 2026, a ...

To capitalize on the demand for generative AI, Toppan Holdings (formerly Toppan Printing) reportedly plans to invest approximately JPY60 billion (US$403 million) to expand the production capacity of ...

SEOUL, South Korea, Feb. 2, 2023 /PRNewswire/ -- LG Innotek (CEO Jeong Cheol-dong) is accelerating the business activities in full-scale for targeting the Flip-Chip Ball Grid Array (hereafter referred ...

With Moon Hyuk-soo, CEO of LG Innotek, promoted to president in the 2026 regular executive reshuffle, LG Innotek is still struggling to bear fruit in new businesses. Unlike Samsung Electro-Mechanics, ...

IC backend houses are being encouraged to increase production capacity in Southeast Asia, especially for BGA packaging, according to industry sources. Save my User ID and Password Some subscribers ...

Comprising a small pc-board with decoupling capacitors on one side and solder balls on the other, the QStack power delivery module attaches directly underneath a BGA package to reduce or eliminate the ...