The facility will be used to build a pilot line aimed at developing scalable ... three-dimensional packaging methods, assembly design kits (ADKs) for complex back-end operations, and known good ...

and advanced packaging, fostering full stack innovation for future semiconductor-based AI applications. The project is supported by the EU Chips Act NanoIC pilot line and receives funding from ...

The funding will help scale its technology for advanced chip manufacturing and packaging ... abrasive-free 300mm copper technology and a pilot line for pad production. This has led to strategic ...