Most chips in today’s smartphones, computers and servers are comprised of multiple smaller chips invisibly sealed inside one rectangular package. How do these multiple chips — often including CPU, ...
Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what ...
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Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...
Intel is a renowned player in the computer CPU business. The company recently launched its 10th Gen Intel processors, which are now based on 10nm fabrication. Besides designing computer CPUs, the ...
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This article is part of the Technology Insight series, made possible with funding from Intel. We tend to focus on the latest and greatest technology nodes because they’re used to manufacture the ...
Siemens Digital Industries Software is collaborating with the Intel Foundry in the development of a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to ...
SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) announced today a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology ...
June 24, 2024 -- Plano, Texas, USA-- Siemens Digital Industries Software announced today that its ongoing collaboration with Intel Foundry has established a new Electronic Design Automation (EDA) ...
In a bid to build better chips for gamers and other PC enthusiasts, Intel has announced the 8th-generation H-series mobile processors will have a feature that’s nothing short of astonishing: they’ll ...
Recently, reports indicated that Intel outsourced its high-end EMIB chip packaging to Amkor Technology for the first time, using Amkor’s advanced facility in South Korea. This move highlights Amkor’s ...
Siemens Digital Industries Software has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high ...
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