India announces its first 3D semiconductor packaging unit in Odisha, boosting AI, 5G and defence manufacturing ambitions!

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

Moving past fabrication focus, India explores advanced packaging where stacking, integration, and materials innovation begin ...

India has laid the foundation for its first advanced 3D chip packaging plant in Odisha, which is a key step in building a ...

Launched in 2021 with a Rs 76,000-crore outlay, the India Semiconductor Mission was conceived as a state-backed push to build ...

Bullock carts and bytes jostle together in the Sanand industrial belt on the outskirts of Ahmedabad. But don't be misled by the rustic settings. Ever since Tata shifted its massive Nano factory almost ...

India is targeting a $400 billion electronics market and a $103 billion semiconductor market by 2030, with such investments ...

In a significant step towards building a domestic semiconductor ecosystem, the Ministry of Electronics and IT on Saturday ...

Mihir Sharma is a Bloomberg Opinion columnist. A senior fellow at the Observer Research Foundation in New Delhi, he is author of “Restart: The Last Chance for the Indian Economy.” It is a truth ...

India’s push to build a robust domestic semiconductor ecosystem took a significant step forward with the foundation of its ...

The foundation stone for India’s first advanced 3D chip packaging unit was laid at Info Valley in the Khordha district in ...