EDN

Designers seek IC/package co-design tools

As IC speeds continue to climb well into the gigahertz range, system designers are finding that the new obstacles they must overcome to interconnect ICs to packages and packages to printed-circuit ...
Nasdaq

Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...
EDN

IC design is a ‘package’ deal

Santa Clara, Calif. — As chip designers, Kaushik Sheth and Egino Sarto struggled to fit silicon into cost-effective packages. Now they're trying to convince other chip designers to adopt a ...
Business Insider

New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board

Solution integrates the Virtuoso platform with Allegro and Sigrity technologies to streamline overall design process and significantly improve productivity and cycle time SAN JOSE, Calif., May 30, ...
Semiconductor Engineering

Six 3D-IC Design Trends That Secure The AI Era

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...
Business Wire

Cadence Advances RF Design with the Latest AWR Design Environment Platform

AWR V16 advances heterogeneous technology development for 5G wireless and connected systems for automotive, radar systems and semiconductor technologies Custom RF to mmWave IP developed with AWR ...
Semiconductor Engineering

The Need For 3D IC Packaging And Design Evolution

If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device ...
Electronic Design

IC Package Houses Complete POL DC-DC Converter

Power supply developer Enpirion (Bloomsbury, N.J.) is one step closer to packing a complete high-performance nonisolated dc-dc converter on a single semiconductor Power supply developer Enpirion ...
Digi Times

IC Design White Paper - Discussing strengths and weaknesses of Taiwan's IC design sector

The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...
Digi Times

IC Design White Paper (3): Contributions from Taiwan's IC design sector to Taiwan

Taiwan is an important hub of the global information and communication technology (ICT) industry. The development of the ICT supply chain is supported by Taiwan's complete semiconductor ecosystem.
Business Wire

Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

MEYREUIL, France & SAN JOSE, Calif.--(BUSINESS WIRE)--Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a ...