According to the new research report "Chip Scale Package (CSP) LED Market by Application (Backlighting Unit (BLU), Flash Lighting, General Lighting, Automotive, Others), Power Range (Low- & Mid-Power, ...

CHANDLER, Ariz.–Chip-packaging giant Amkor Technology Inc. said it is expanding capacity for stacked chip-scale packages (S-CSP) to meet huge OEM demand. Already among the largest producers of stacked ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...

Tessera Inc. Friday will unveil a new ultra-thin tri-fold stacked chip-scale package (CSP) co-developed with Intel Corp. for that firm's highest-density flash memory. Bruce McWilliams, president and ...

AUSTIN, Texas--(BUSINESS WIRE)--May 16, 2006--Staktek Holdings, Inc. (Nasdaq:STAK), a world-leading provider of intellectual property and services for next-generation, chip-stacking and module ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced digital component solutions, today announced two new additions to its chip-scale package (CSP) line-up: ...

In a single chip-scale package (CSP) measuring only 1.4-mm in thickness, the company has managed to stack a PSRAM, one SRAM, and two flash memory chips, plus a spacer chip. Employing a proprietary ...

A fully qualified, high-performance, low-power and small-form-factor wafer-level chip-scale package (W-CSP) developed by Oki Semiconductor satisfies a wide range of ASIC design demands. Targeting chip ...

Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing ...

When hackers found and developed ways to order PCBs on the cheap, it revolutionized the way we create. Accessible 3D printing brought us entire new areas to create things. [Matt Venn] is one of the ...