TL;DR: NVIDIA’s B300 AI chip production is accelerated to May, utilizing TSMC’s advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs ...

Nvidia will make 5 million B200/B300 which are the leading edge AI GPU chips. They could make about 10 million advanced next generation chips ... and an Angel Investor at Space Angels. A frequent ...

optimized to the thermals and internal topology of the NVIDIA HGX B300 NVL16 and GB300 NVL72. Our advanced liquid-cooling solution delivers exceptional thermal efficiency, operating with 40 ...

with the beefed-up B300 and GB300 chips to also reportedly use TSMC's new CoWoS-L advanced packaging. In a new report from TrendForce, we're learning that the B200 Ultra has been renamed to the ...