Is Applied Materials (AMAT) Quietly Rewiring Its AI Moat With New DRAM And Packaging Tools?

In recent days, Applied Materials introduced a new epitaxy system for DRAM, plus CMP, deposition and eBeam tools aimed at ...

Applied Materials (AMAT) Expands AI Chip Tools With New DRAM And 3D Packaging Systems

Applied Materials (NasdaqGS:AMAT) announced a major expansion of its product suite focused on next generation AI chip ...
Business Wire

Applied Materials Releases the Industry’s Most Advanced, Productive CMP Platform – the Reflexion GT

TOKYO--(BUSINESS WIRE)--Applied Materials, Inc. today raised CMP * technology to a new level while lowering system cost of ownership (CoO) with the launch of its Applied Reflexion ® GT system for ...

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...
DATAQUEST

Applied Materials intros new systems to accelerate 3D architectures powering AI chips

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip ...

Applied Materials unveils more advanced chipmaking gear for 3D stacking architectures

Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so ...
EDN

Soitec selects Applied’s CMP technology for 300-mm SOI wafers

BERNIN, France — Soitec SA, a supplier of silicon-on-insulator (SOI) wafers, has selected Applied Materials' 300-mm Reflexion chemical mechanical polishing technology to help it manufacture Unibond ...