As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...
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Applied Materials and Besi expand AI advanced packaging partnership through EPIC Center
The expanded collaboration moves beyond hybrid bonding into 3D IC integration, thermo-compression bonding, panel-scale ...
Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...
Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...
KAOHSIUNG, April 15, 2026 /PRNewswire/ -- E&R Engineering Corp. (8027.TW), a leading provider of innovative semiconductor process equipment, will participate in the International Semiconductor ...
AI is pushing semiconductor innovation beyond transistor scaling toward advanced packaging, photonics, thermal management and ...
This achievement marks the beginning of a new era in packaging innovation, especially for 3D chip integration architectures with built-in energy sources. ITEN and A*STAR IME are actively exploring ...
Please join the U.S. National Science Foundation Directorate for Engineering on February 13, 2024, from 11 a.m. to 12 p.m. Eastern for a Distinguished Lecture by Intel Fellow Dr. Ravi Mahajan on “How ...
E&R Engineering Corp. (TPEX: 8027), a specialist in semiconductor laser and plasma processing equipment, will highlight its latest semiconductor laser processing breakthroughs at SEMI West 2026, ...
HSINCHU, Aug. 15, 2025 /PRNewswire/ -- As demand for AI and HPC accelerates, the semiconductor industry is embracing a new era. With Moore's Law slowing and scaling challenges rising, technologies ...
Failure analysis has become an integral part of process optimisation and has evolved from a 2D process to a 3D challenge, writes Dr Mohan Iyer. For decades semiconductor failure analysis largely ...
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