PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...
uPI achieves a 2X improvement in thermal cycle endurance for their semiconductor product packages with Ansys' multiphysics simulation solutions Ansys' predictive simulation insights enable uPI to ...
An international research team has proposed a novel photovoltaic-thermal (PVT) module design that purportedly reduces the risks of cracking in the panel's PV unit. “A critical issue for PVT collectors ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results